MORIMURA BROS., INC.

Toray Adhesive Sheets for Semiconductor and Electronic Components

Toray challenges to become a total solution provider by the wide variety line up of adhesive sheet.
(1) Wide process margin. (ex. Lamination, Punching, Cover film delamination.)
(2) Excellent reliability. (Insulation reliability, Temperature/Humidity durability, Chemical resistannce)
(3) Low warpage allows easy sealing on the various substrate.
(4) Environmental friendly. (Low ion impurity content, Lead free solder applicable, Halogen free)

Toray Adhesive Sheets for Semiconductor and Electronic Components
Toray Adhesive Sheets for Semiconductor and Electronic Components

page top